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TU-768 PCB 2-layer 0.8mm immersion gold

Shenzhen Bicheng Electronics Technology Co., Ltd
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TU-768 PCB 2-layer 0.8mm immersion gold

Brand Name : Bicheng Enterprise

Model Number : BIC-0251-V2.51

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 2.99-5.99 PER PIECE

Payment Terms : T/T, Western Union

Supply Ability : 45000 pieces per month

Delivery Time : 5-6 working days

Packaging Details : Vacuum

Number of Layers : Single sided PCB

Glass Epoxy : Polyimide 0.1mm, FPC

Final foil : 1 Oz

Final height of PCB : 0.1 mm ±10%

Surface Finish : Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel)

Solder Mask Color : Yellow

Colour of Component Legend : White

Test : 100% Electrical Test prior shipment

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TU-768: Unleashing the Potential of High-Tg and High Thermal Reliability Laminate


Welcome to the world of TU-768, an exceptional high-Tg and high thermal reliability laminate offered by Taiwan Union. Engineered to meet the exacting demands of cutting-edge electronic applications, TU-768, along with its matching prepreg TU-768P, delivers unrivaled performance in terms of thermal stability, chemical resistance, and reliability. In this comprehensive blog post, we will explore the remarkable features, benefits, PCB stackup, construction details, and typical applications of TU-768.

Unveiling the Power of TU-768:
TU-768 and TU-768P laminates/prepregs are crafted using top-grade woven E-glass coated with an advanced epoxy resin system. This powerful combination endows the laminates with UV-blocking characteristics and seamless compatibility with automated optical inspection (AOI) processes. Let's delve into the exceptional features and benefits that make TU-768 truly stand out.

Extraordinary Features:

  • Dielectric Constant (Dk): TU-768 boasts an impressive Dk of 4.3 at 10GHz, ensuring robust signal transmission and minimal signal loss, even in high-frequency applications.
  • Dissipation Factor: With an incredibly low dissipation factor of 0.0023 at 10GHz, TU-768 maximizes energy efficiency and facilitates seamless signal propagation, contributing to superior system performance.
  • Coefficient of Thermal Expansion (CTE): TU-768 exhibits a precise CTE range of 11-15 ppm/°C in both the x-axis and y-axis, guaranteeing exceptional dimensional stability and mitigating the risk of thermal stress-induced failures.
  • Unmatched Thermal Reliability: TU-768 is purpose-built to withstand severe thermal cycles and demanding assembly work, offering unparalleled thermal stability. It features a remarkable Tg (glass transition temperature) of 180°C, ensuring uncompromising reliability even under elevated temperature conditions.
  • Impressive Chemical and Moisture Resistance: TU-768 showcases outstanding resistance to chemicals and moisture, safeguarding the integrity and reliability of the PCB, even in the harshest environments.
  • Seamless Compatibility and Fluorescence: TU-768 is fully compatible with lead-free processes, making it an excellent choice for environmentally conscious manufacturing practices. Additionally, its fluorescence feature enables effortless inspection using automated optical inspection (AOI) systems.

Unleashing the Benefits:

  • Superior Coefficient of Thermal Expansion (CTE): TU-768's CTE is meticulously matched to that of copper, significantly reducing the risk of thermal stress and ensuring robust solder joint integrity.
  • Effective Anti-CAF Property: TU-768 exhibits exceptional resistance to Conductive Anodic Filamentation (CAF), enhancing the long-term reliability of the PCB, particularly in humid environments.
  • Unparalleled Chemical and Thermal Resistance: The laminate's exceptional chemical and thermal resistance properties fortify the integrity and performance of the PCB, ensuring longevity and durability.
  • Optimal Signal Integrity: With its low dielectric loss and stable electrical properties, TU-768 upholds excellent signal integrity, guaranteeing reliable and precise data transmission.

PCB Stackup and Construction Details:
For a 2-layer rigid PCB utilizing TU-768, the recommended stackup is as follows:

  • Copper Layer 1: 35 μm
  • TU-768 Core: 0.76 mm
  • Copper Layer 2: 35 μm

The construction details encompass vital specifications such as board dimensions, minimum trace/space, hole size, finished thickness, copper weight, via plating thickness, surface finish, silkscreen colors, solder mask colors, and the inclusion of electrical testing.

Unlocking the Potential: Typical Applications:

  • TU-768 finds widespread applications across various industries, including:
  • Consumer Electronics: The laminate's exceptional thermal reliability and chemical resistance make it a perfect fit for smartphones, tablets, and other portable electronic devices.
  • Server and Workstation: TU-768 ensures reliable performance in high-heat server and workstation environments, guaranteeing uninterrupted operation and enhanced system efficiency.
  • Automotive: With its outstanding thermal stability and moisture resistance, TU-768 proves highly suitable for automotive applications, including electronic control units (ECUs) and infotainment systems.


TU-768 from Taiwan Union represents the pinnacle of high-Tg and high thermal reliability laminate, meticulously designed to fulfill the exacting requirements of advanced electronic applications. Its exceptional features, benefits, and seamless compatibility make it an unrivaled choice across diverse industries. By integrating TU-768 into your PCB designs, you unlock a world of reliable performance, thermal stability, and lasting functionality.


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